For the past seventy years, ferrites (magnetic ceramics) have been
prized for a range of properties that has no equivalent in the existing
metal magnetic materials. They have contributed to many important
advances in electronics and new high-performance products are appearing
all the time. Ferrite technology has produced greater progress in the
past 15 years since the first edition was published. Many of the
semiconductor and IC technology responsible for the computer and
Internet explosion would not have been possible without the magnetic
materials technology needed for powering and otherwise exploiting those
developments.
Modern Ferrite Technology, 2nd ed, offers the
readers an expert overview of the latest ferrite advances as well as
their applications in electronic components. This volume develops the
interplay among material properties, component specification and device
requirements using ferrites. Throughout, emphasis is placed on practical
technological concerns as opposed to mathematical and physical aspects
of the subject.
The book traces the origin of the magnetic
effect in ferrites from the level of the simplest particle and the
increases the scope to the larger and larger hierarchies. From the
desired magnetic properties the author deduces the physical and chemical
material parameters, taking into consideration major chemistry,
impurity levels, ceramic microstructures and grain boundary effects. He
then discusses the processing conditions and associated conditions
required for implementation. In addition to conventional ceramic
techniques, he describes non-conventional methods such as
coprecipitation, co-spray roasting and single crystal growth.
The
second section of this book deals with a complete listing of the many
important applications in the field including ferrites for permanent
magnet, telecommunications, power supplies, memory systems magnetic
recording and microwave applications.
The function of ferrites in
each of these applications is described. The requirements of the
electronic circuit and device are broken down into the individual
component specifications with regard to size and configuration. Design
criteria for power level, degree of stability and cost are then
considered.
